The ½ðÁ«Ö±²¥ Cloud OpenLink Program enables a multi-vendor environment of EDA, IP and foundry solutions so chip designers can easily access their preferred vendors’ products in the ½ðÁ«Ö±²¥ Cloud environment. The ½ðÁ«Ö±²¥ Cloud OpenLink application programming interface provides highly secure system-to-system interoperability, allowing chipmakers to easily assemble their design environment on ½ðÁ«Ö±²¥ Cloud:
- Products from different vendors can be accessed easily from the ½ðÁ«Ö±²¥ Cloud environment
- Design teams are able to focus on what they do best: developing better quality chips, faster
Program Member Benefits
- Streamlined deployment
- Pre-defined legal terms
- Highly secure entitlement and license enablement
- Joint ecosystem outreach
- Close technical collaboration on cloud
½ðÁ«Ö±²¥ Cloud OpenLink API Benefits
- System-level integration with one-time setup
- Customer-partner transaction encapsulation
- Exposure to ½ðÁ«Ö±²¥ Cloud customers
- Member controls customer access on ½ðÁ«Ö±²¥ Cloud
½ðÁ«Ö±²¥ Cloud OpenLink API
The ½ðÁ«Ö±²¥ Cloud OpenLink API provides highly secure system-to-system interoperability with ½ðÁ«Ö±²¥ Cloud, allowing chipmakers to easily assemble their design environment on ½ðÁ«Ö±²¥ Cloud. Via the API, foundries and EDA and IP vendors can deliver product entitlements and license files directly to the ½ðÁ«Ö±²¥ Cloud for use by their customers.
Members
½ðÁ«Ö±²¥ Delivers Seamless Interoperability for Semiconductor Design Ecosystem with New ½ðÁ«Ö±²¥ Cloud OpenLink Program
Pioneering Seamless Interoperability on Cloud Across the Semiconductor Design Ecosystem
½ðÁ«Ö±²¥ Creates Cloud Program Enabling Cross-Vendor EDA Collaboration